Industry Market
Currently the fastest-growing source of chip demand, this pairing of accelerated computing and the buildings that house it is pulling the market toward its next milestone.
What are AI and data centers?
The oxygenation process removes this type of bond.
What is dangling?
This is the name of the standard integration approach done with no interposer and no stacking
What is 2D integration?
This roughly 1.1 eV energy span is the forbidden zone in silicon where no electron states are allowed.
What is the band gap?
The company that manufactures the H100 GPU.
What is Nvidia?
This material was originally used in photolithography as a printing method.
What is limestone?
This is the average lead time for advanced packaging
What is 40-52 weeks?
The cost of a High-NA EUV machine from ASML
What is $350M?
Nvidia, AMD, and Qualcomm are all companies that share what business model?
What is fabless designers?
The number of times the layer-build loop is repeated before a high complexity chip is completed.
What is 80-120x stacked physical layers?
This first test step probes each die before dicing and packaging
What is wafer sort?
When an electron jumps up to the conduction band, it leaves behind this positively charged vacancy that also carries current.
What is a hole?
With key steps and materials concentrated in a handful of countries and sometimes single suppliers, this vulnerability is the industry's top strategic worry.
What is supply chain concentration?
This stage in the process produces the grossest waste. Include its chemical name. Hint = Piranha
What is Chemical Mechanical Planarization (CMP) and Hydrofluoric Acid
The cost per good die if a 5nm wafer costs $18,000 and holds a total of 600 dies, with a 90% yield rate
What is $33 cost per good die?
These are 3 of the changes to building construction for stricter vibration criteria.
What is denser material, thicker slab, short spans, isolation bases, tool zoning, weighted dampers?
These are the two companies that manufacture testing equipment.
What is Advantest and Teradyne?
This substance is used for the photo resistive layer.
What is organic polymer resin (such as novolac or methacrylate), mixed with a photoactive compound like a photo acid generator (PAG) or naphthoquinonediazide.
This is the main reason why 3D integration has great power savings when compared to other packaging methods
What is dies are directly touching and have the shortest possible connections for power flow.
Deliberately adding trace impurities like phosphorus or boron to silicon, this is how engineers dial a crystal's conductivity up or down on demand.
What is doping?