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Metal Mania
Troubleshooting
Alphabet Soup

100

This product cleans more BEOL layers than any other formulated clean
What is ST-250?

100

CLK-888
What is Avantor? or What is JT Baker?

100

This metal conducts better than Al and has taken over most interconnect duties
What is Cu?

100

The widening of a trench or via due to unwanted etching
What is CD loss? What is ULK damage layer etch?

100

TFMHM
What is Trench First Metal Hard Mask?

200

Samsung practically drinks this for both PERR and PCMP
What is ESC-784?

200

CLC-32
What is BASF?

200

This metal is a potential replacement for TaN as Cu barrier
What is Co?

200

This happy face makes engineers sad as it comes from Cu etch during cleans
What is smiling curve? -or- What is Cu undercut?

200

VFDD
What is Via First Dual Damascene?

300

An Intel-specific SLAM/residue remover
What is AP-761?

300

EKC-520
What is DuPont?

300

This metal remains the most common used at Contact level
What is W?

300

The increased etch rate of one metal when in the presence of a second metal
What is galvanic corrosion?

300

DBARC
What is Developable Bottom Anti-Reflective Coating?

400

An improved ST-250, this product never found an install base
What is ST-255?

400

ACT NE-111
What is Air Products?

400

This metal can be a barrier for W and is also widely used as a hard mask
What is TiN?

400

Also known as stiction, this phenomenon is truly a "sticky" situation
What is pattern collapse?

400

ULK
What is Ultra-Low k [dielectric]?

500

The next generation in Cu post-etch cleaning
What is TiTaN klean?

500

MS 7000
What is Fujifilm?

500

With its elemental cousin, this metal is the standard as a Cu barrier
What is TaN?

500

Leftovers that can be met with high resistance and "void" the contact
What is incomplete residue removal?

500

BPSG
What is Boro Phospho Silicate Glass?