We're Number 1! The Loyal Opposition Metal Mania Troubleshooting Alphabet Soup

100

What is ST-250?
This product cleans more BEOL layers than any other formulated clean

100

What is Avantor? or What is JT Baker?
CLK-888

100

What is Cu?
This metal conducts better than Al and has taken over most interconnect duties

100

What is CD loss? What is ULK damage layer etch?
The widening of a trench or via due to unwanted etching

100

What is Trench First Metal Hard Mask?
TFMHM

200

What is ESC-784?
Samsung practically drinks this for both PERR and PCMP

200

What is BASF?
CLC-32

200

What is Co?
This metal is a potential replacement for TaN as Cu barrier

200

What is smiling curve? -or- What is Cu undercut?
This happy face makes engineers sad as it comes from Cu etch during cleans

200

What is Via First Dual Damascene?
VFDD

300

What is AP-761?
An Intel-specific SLAM/residue remover

300

What is DuPont?
EKC-520

300

What is W?
This metal remains the most common used at Contact level

300

What is galvanic corrosion?
The increased etch rate of one metal when in the presence of a second metal

300

What is Developable Bottom Anti-Reflective Coating?
DBARC

400

What is ST-255?
An improved ST-250, this product never found an install base

400

What is Air Products?
ACT NE-111

400

What is TiN?
This metal can be a barrier for W and is also widely used as a hard mask

400

What is pattern collapse?
Also known as stiction, this phenomenon is truly a "sticky" situation

400

What is Ultra-Low k [dielectric]?
ULK

500

What is TiTaN klean?
The next generation in Cu post-etch cleaning

500

What is Fujifilm?
MS 7000

500

What is TaN?
With its elemental cousin, this metal is the standard as a Cu barrier

500

What is incomplete residue removal?
Leftovers that can be met with high resistance and "void" the contact

500

What is Boro Phospho Silicate Glass?
BPSG

ATMI Cleans Jeopardy

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