FEOL
What tool sets does FEOL use?
LK + LK prime
Which tool type is used for SDB Buffing?
Ebara
What equipment(s) is(are) being used in MOL?
Ebara
What is the most consistent issue weve seen at M1?
unCMP
What different tool types will all of CMP be getting?
Ebara, LK, LK Prime
What kind of IM tool will FEOL be using?
ONTO
What is the material that SAC and SDB polishes?
SiN
How are the 4 PRCs of CMP_W_CTE different?
They're not.
How many PRCs does BEOL have?
4 total
How many paths do Ebaras have?
Two
How many layers are in FEOL total?
9 layers
What step doess NOVA feed forward to metal gate recess etch?
W gate
What does CWON stand for?
Colt, Tungsten, Oxide, Non-selective
What layers mimic 14nm layers
IA/IB
What software is being used to model fab layout?
5D system
Why was early pad life restriction of 2 hours applied to PO1?
Edge thk low at early pad life
What is the new slurry abrasive type for SDB to decrease CA etch blocking?
Silica
What is the most likely cause of top loss?
Lack of Tungsten corrosion inhibitor
Why was humidity more of an issue at S5 than S3?
LK3.0 at S5 has plate in middle of tool preventing a spoiler from redirecting air like at S3
How many zones does the Ebara retaining ring have?
8 zones
What RACB is being run to improve STI/DTI edge over polish?
Z1/Z2 downforce 10% reduction
What is the variable that impacts iAPC for SAC full?
Pad Lifetime
What is the highest risk DOI in MOL and why?
Ti Residue because it has very low detection rate and can easily affect reliability
Why is M1 targeting important to Device team?
High M1 tgt = lower resistance / delay time = better device performance
What is a big disadvantage to LK prime cleaners?
Only one running beam so if it goes down both paths will have an issue returning wafers.