Opportunity Eval.
When presented an opportunity for a PCB application, you should do this.
What is send to APC for evaluation.
This process joins the etched cores with B-stage adhesive to form a composite, ready for drill.
What is lamination.
This city, nicknamed "Gate City" is home to Amphenol's largest circuit board fabrication.
What is Nashua.
The whole process starts when APC purchases C-stage dielectric laminate most often clad in this metal.
What is copper.
When pursuing a connector or other opportunity for any electrical system, you should do this.
What is ask if they need PCBs or PCBAs.
High density routing is enabled on circuit boards by this special kind of plated hole, formed by a laser.
What is a microvia.
Special expensive dielectric materials, copper, and drilling processes contribute to minimizing this most important RF parameter, making higher PCB premiums worth it.
What is insertion loss.
Structural cores with air-like dielectric properties can be integrated into circuit boards using this material.
What is foam.
When presented an opportunity for a PCB application and you're pretty certain it's not a fit for APC, you should do this.
What is send to APC to evaluate.
This process can reduce return loss from a circuit board by minimizing the stub, or extra part of a plated via that extends past the target interconnect layer.
What is backdrill.
This cartoony sketch of a circuit board shows all the structures in the board in one compact view.
What is a stackup.
Amphenol Printed Circuits uses this special paste material to join two or more PCBs together, eliminating thousands of connectors in some cases and reducing the Z footprint.
What is Ormet.
Parasitic inductance can be reduced as well as surface real estate using this feature in specific areas of the PCB, to bury a component.
What is a cavity.