p-type silicon has more holes
Which type silicon has more holes.
Twin tub process is a VLSI fabrication process.
What is twin tub process
Explanation: Conducting layer is separated from the substrate by using dielectric or insulating layer as both are electrical insulators that can be polarized by an applied electric field.
Conducting layer is separated from substrate using
Explanation: Gate to channel capacitance of 5 micron technology is 4 pF X 10(-4) (micrometer)2. It is the standard typical calculated value.
Gate to channel capacitance of 5 micron technology is _____ pF X 10(-4) (micrometer)2.
Explanation: Area capacitane of diffusion region of 2 micron technology is 3.75 pF X 10(-4) (micrometer)2.
technology is _____ pF X 10(-4) (micrometer)2
Explanation: The relative capacitance of diffusion region of 5 micron technology is 0.25. The relative value is calculated by comparing two values of same type.
What is the relative capacitance of diffusion region of 5 micron technology?
Explanation: A feature size square has L = W and its gate to channel capacitance value is called as square Cg.
A feature size square has ___________
Explanation: Relative area for L = 20λ and W = 3λ is = (20λ X 3λ) / (2λ X 2λ) = 15. Relative area has no unit as two quantities of same type have been used.
Relative area for L = 20λ and W = 3λ is?
Explanation: The transition point of an inverter is 0.5 Vdd. The transition point is the point where different phases of same substance can be obtained in equilibrium.
What is the transition point of an inverter?
Explanation: The desired or safe delay value for 5 micron technology is 0.3 nsec.
What is the desired or safe delay value for 5 micron technology?