Films
Etch, etc.
Photo finish
Grab Bag
Oxidation
100

Chemical Vapor Deposition processes occur in this Phase.

What is the Gas Phase?

100

Etch rate and profile, selectivity, uniformity, and etch bias are properties important to this process?

What is dry etch?

100

This determines the accuracy by which subsequent (following) layer accuracy can be performed.

What is mask overlay?

100

CMOS devices have to incorporate these type of doped wells.

What are n-well and p-well?

100

The oxidation of silicon involves these two separate growth rates behaviors.

What are linear and parabolic?

200

These are favorable characteristics of optimized thin films in submicron processing.

What is High Aspect Ratio Conformality and Good Step Coverage?

200

Anisotropic etching processes etch material in this direction.

What is one direction?

200

This is the first step in photolithography is critical to adhesion.

What is vapor prime?

200

This component selects out the correct ion to be implanted and redirects unwanted species.

What is analyzer magnet?

200

Improved gas flow dynamics, improved defect control, uniform temperature distribution are characteristics of this type furnace.

What is Vertical Furnace?

300

This very dense conductive film is used to form the vertical via structures in ILD layers.

What is Tungsten?

300

This formula is the definition of Etch Rate.

What is change in thickness over time.

300

The correct sequence of a general Photolithography Process starts with this critical step.

What is vapor prime?

300

Polish time, platen speed, slurry chemistry determine what?

What is the degree of planarization?

300

Silicon Dioxide's structure is best described as this type of film.

What is amorphous?

400

These are the 4 basic types of planarization.

What are smoothing, partial, local, global?

400

Polymer Sidewall Passivation in dry etch is process used to do improve this.

What is the anisotropic etch properties?

400

These two photolithography light sources used in submicron processing in UV spectral region.

What are excimer laser &  mercury lamp?

400

The energy band gap for silicon is this value.

What is 1.12 eV?

400

Charge generated from the oxidation process parameters is this type.

What is Fixed Oxide charge?

500

Masking, device isolation, capacitors, implant screens, dopant barriers are characteristics of this type of film.

What are oxides?

500

The 3 main elements to almost all chemical reactions.

What are transport, reaction, removal by-products?

500

Centipoise is the unit used to measure of this property.

What is viscosity?

500

Silicon used to make silicon wafers is this type of material.

What is mono-crystalline or single crystal?

500

When silicon dioxide grows from a silicon surface the growth rate becomes parabolic due to this mechanism.

What is O2 limited diffusion thru oxide?