General Probers
This machine positions a wafer so its dies can make controlled contact with a probe card during electrical testing.
What is a wafer prober?
These restraints must be removed from the OPUS3 motion axes before normal initialization and movement.
What are shipping or fixed brackets?
Unexpected movement, collision, abnormal sound, smoke, odor, or a utility leak requires the technician to take this immediate action.
What is stop work and place the equipment in a safe state?
This production stage electrically evaluates individual dies while they are still together on the wafer.
What is wafer sort or electrical die sorting?
This fabless company designs GPUs and accelerated-computing platforms that have become central to AI and high-performance computing.
Who is NVIDIA?
This flat, vacuum-controlled component supports the wafer and may heat or cool it during testing.
What is the chuck?
During final OPUS3 leveling, these machine components must remain raised and clear of the floor.
What are the stage wheels?
Before issuing additional recovery motion, the technician must confirm this physical condition and compare it with the system display
What is the wafer’s actual location and condition?
This equipment generates electrical test signals, measures device responses, and assigns pass/fail bins.
What is automated test equipment, or ATE?
This Taiwanese company is the world’s largest dedicated semiconductor foundry, manufacturing chips designed by fabless customers.
Who is TSMC?
This precision interface contains the needles or MEMS contacts that connect wafer pads to the tester.
What is a probe card?
An off-center wafer landing must be corrected through this machine-level setting—not by shifting the wafer map.
What is Chuck Loading Position or Chuck Centering?
Position, lighting, focus, character region, and acceptance settings should be checked when this wafer-identification system repeatedly fails.
What is OCR?
This electronic record connects each die’s physical wafer location with its test result, bin, and test status.
What is a wafer map?
This Dutch equipment company supplies the EUV lithography systems used to manufacture the smallest advanced semiconductor features.
Who is ASML?
This term describes the additional Z-axis movement applied after the probe tips first touch the wafer pads.
What is overdrive or overtravel?
This is the maximum acceptable min-to-max variation specified for the OPUS3 nine-point chuck-planarity check.
What is 15 micrometers?
Changing the pin high-magnification X, Y, or Z offset invalidates this saved probe-card reference process, which must then be repeated.
What is Pin Registration?
This term describes a die tested before assembly and judged suitable for use in an expensive multi-die package.
What is a known-good die?
This Japanese semiconductor-test company produces the V93000 SoC tester and high-parallelism memory-test systems used during wafer sort and final test
Who is Advantest?
The prober, probe card, and this signal-generating system form the three primary parts of a wafer-test cell.
What is automated test equipment, or ATE?
This OPUS3 operating mode validates wafer exchange, alignment, partial-lot handling, and ODTP output without a tester connection or probe card.
What is Demo Running?
Uneven probe marks across the wafer should prompt inspection of chuck flatness, card flatness, tip height, and structural deflection before increasing this contact parameter.
What is overdrive?
Companies specializing in outsourced semiconductor assembly, packaging, and test are known by this four-letter abbreviation
What are OSATs?
This company’s test-equipment portfolio includes UltraFLEX for complex SoCs, J750 for high-throughput microcontroller testing, and Magnum for highly parallel memory testing.
Who is Teradyne?